Silicone New Material Series
有机硅新材料
Two-component silicone potting adhesive
|
Grade
|
Apperance
|
Viscosity
mPa·s
|
Density
g /cm3
|
Mix ratio
weight
|
Operating time
min ,25℃
|
Curing condition
|
|||||
|
Part A
|
Part B |
Part A
|
Part B |
After mixing
|
Part A | Part B |
A :B
|
TPS
|
25℃/h
|
Heating
|
|
|
RH-PG0184
|
Transparent
|
Transparent |
6000±500
|
6000±500
|
4500±300
|
1±0.05
|
1±0.05
|
10:1
|
>120
|
/
|
30min /120℃
|
|
RH-AS1100
|
Black
|
Transparent |
2250±250
|
1750±250
|
2000±250
|
0.95±0.05
|
0.95±0.05 |
1:1
|
>30
|
4~5
|
30min~1h
/50℃ |
| Grade | Apperance |
Hardness
|
Volume
resistivity |
Dielectric strength
|
Permittivity
|
Thermal
conductivity
|
Operating
temperature
|
Packing
25℃/h |
|
ShoreA
|
Ω·cm
|
KV/mm
|
25℃,100MHz
|
W/m·k
|
℃
|
|||
| RH-PG0184 | Transparent |
47~49
|
/
|
>15
|
/ | / |
-40~200
|
20kg/2kg
|
| RH-AS1100 | Black |
4~5
|
≥1×1015
|
>8
|
/ | / |
-40~200
|
20kg
|